Intel Lakefield is the 1st mobile processor from intel which will make use of Foveros technology.
Foveros may be a chip stacking technology that permits Intel to mix their mainstream CPU cores with a number of their low-power CPU cores to supply hybrid CPUs in kind of the way ARM does with their big.LITTLE technology.
Today’s announcement revolves around two processors, the Core i5-L16G7 and therefore the Core i3-L13G4 which use one 10nm Sunny Cove big core with four 10nm Tremont small cores. There isn’t any information regarding any Core i7 or Core i9 variant so one could assume that the simplest of Lakefield is yet to return .
Lakefield was first announced by Intel at their 2019 CES keynote session and Intel began some rather ambitious goals for Lakefield when it introduced the Foveros concept.
These included A level of power efficiency that might consume 1/10th of the Standby Power of their existing architecture, rise up to 50% more graphics performance while reducing the general area occupied by 40%. That goes for the z-height (40% reduction) also the general design goals in layman’s terms would be to form powerful laptops that are smaller while consuming less power.
Did Lakefield achieve those goals? We’ll need to await the official benchmarks except for now these are what Intel claims.
Hybrid Intel Processors
Lakefield processors are the primary from Intel to ship with package-on-package (PoP) memory which suggests the PCBs of those devices can take up less space. Moreover the standby power can go as low as 2.5 mW which is supposedly a discount of 91% compared to Y-series processors.
They even have two display pipes natively which allows dual display form factors to be built with individually addressable parameters. These will allow manufacturers to create smaller computers than before.
Chris Walker, Intel corporate vice president and general manager of Mobile Client Platform said, “Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs.
Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”
The Lakefield Core i5-L16G7 was spotted earlier this year on UserBench with a score of fifty .3% above average. A variant, the Core i5-L15G7 popped abreast of GeekBench with one threaded score of 725 points and a multi-core score of 1566 points.
If we were to match it with the Core i7-8500Y, it doesn’t seem impressive as long as the 8500Y scores 3990 points on the single-core and 6150 points on the multi-core benchmark. we should always means that these scores were spotted an extended time ago and there would obviously are improvements since then but to not the extent of besting the 8500Y.